X-ray inspection can be a very effective and non-destructive type of analysis. This form of interactive radiography provides internal viewing of an assembly’s design, internal components, workmanship and potential latent quality issues. Digital X-ray technology has added a new dimension to X-ray inspection that extends beyond traditional film-based cabinet type technology, including the use of specially devised algorithms for void analysis.

The term “digital” in digital X-ray refers to the technology of image acquisition where the data is collected or transferred to electronically stored media. Digital radiography detector technologies such as image intensifiers and solid-state panels can vary in size and pixel count. Digital radiography-based systems can offer the ability to view a sample while manipulating magnification, X-Y directions, rotation, tilt, and exposure. The advantage of digital X-ray over traditional film X-ray inspection is the improved imaging at magnification and the ease of image optimization.

Actively inspecting a device under manipulation is known as “real-time radiography”. Real-time X-ray systems can be equipped to mechanically rotate a device in steps, through a defined angular sequence, while collecting individual exposures. The exposures are assembled into a 3-dimensional model, where thin slices of the device can be generated and viewed, or stitched into 3D renderings, referred to as Computed Tomography or CT-Scans.

Standards & Specifications

  • MIL-STD-1580
  • MIL-STD-883, TM 2012*
  • MIL-STD-750, TM 2076*
  • MIL-STD-202, TM 209*
  • MIL-DTL-3933
  • MSFC-STD-355
  • ESCC 20900
  • IDEA-STD-1010
  • ASTM E1161
  • ASTM E431

*ORS USA maintains DLA suitability for these test methods


  • Submicron spot size
  • 130 KV Range
  • Image analysis and measurement software
  • Oblique angle viewing 0 to 45 degrees
  • Digital imaging
  • Maximum inspection area of 18” x 16” (458mm x 407mm)

ORS will also work with clients to develop a specific Statement of Work (SOW) curated to the client’s analytical needs and ORS’ capabilities

Printed Circuit Board

  • Solder Joint Formation
  • Metallization Defects & Registrations
  • Via Alignment

Ceramic Packages

  • Frit Seals
  • Foreign Material
  • Die Attach

Metal Packages

  • Lid Seals
  • Die Attach

Plastic Packages

  • Die Placement
  • Die attach voiding
  • Bond Wire Sweep

Ball Grid Arrays

  • Solder Sphere Formation & Voiding
  • Die Attach

Failure Analysis

High voltage silicon carbide diode with severe EOS damage

Folds in the plated thru-hole barrel

Crack in capacitor

Non-functioning key FOB

Void Analysis

Contact area voiding in QFN

BGA void analysis

Lid seal voiding in microcircuit

Bellows solder joint void analysis

Electronic Part Types

Integrated circuit

Hybrid microcircuit



Glass-bodied Diode


Crystal Oscillator






Multipin Connector



Wire-wound resistor

Multi-anode tantalum chip capacitor

RF Connector

Other part types:

  • DC-DC Converter
  • Diodes (Thin key, Schottky, Wire-bonded, Zener voltage regulator)
  • EMI Filter
  • Isolator
  • Quartz Crystal
  • Bellows assemblies and sub-assemblies
  • Optocoupler
  • Filtered Connector
  • Power Divider
  • Resistor Network
  • Fuse
  • Switch
  • PCBs

Get more information about X-ray inspection.

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